Adept came up with a patented CMOS sensor that mates to an
amorphous Selenium X-ray detector. By using a 3um CMOS process
(permitted by the large pixel size), a very large die was designed (pictured
above). To allow for large tiled arrays, the die was designed with
no peripheral circuitry on 3 out of the 4 sides, to minimize the distance
between the active imaging areas.
To keep the yield high, Adept designed 2 redundant CMOS APS
pixels for every detector pixel site. This redundancy achieved a yield
of nearly 85% on a wafer scale die. The actual die
measures a full 67mmx56mm and occupies the entire 4" wafer.